This is a guide for those involved in the procurement, design, or fabrication of high-speed impedance or insertion loss-controlled PCBs and complex HDI PCBs requiring detailed documentation. While a follow-up to The Printed Circuit Designer's Guide to Secrets of High-speed PCBs, Part 1 and Part 2, this book stands on its own. Designed to help you bridge the gap between the idealized environment of your CAD or CAM system, the specifications for PCB procurement, and the complex realities of manufacturing processes, this edition provides a deeper understanding of how production materials, processes, and testing methods can differ from the multi-digit precision you may be tempted to specify, often leading to unrealistic expectations.

This book is for PCB designers, engineers, and procurement teams, or anyone who wants to learn more about what can and can't be achieved when a suite of CAD layout data and its associated stackup are submitted to the fabrication process. In addition, this edition emphasizes the most effective methods for transitioning quality designs from prototype to production with a focus on signal integrity. In the realm of signal integrity, the most skilled designers and fabricators consistently measure, model, and then measure again to guarantee the highest quality and predictable signal integrity in their designs and products.